OpportunityTitle: Next-Generation Microelectronics Manufacturing (NGMM)
AdditionalInformationOnEligibility: All responsible sources capable of satisfying the Government&apos;s needs may submit a proposal that shall be considered by DARPA.  See the Eligibility Information section of the BAA for more information.
Description: Amendment 02 - The purpose of this amendment is to extend the Full Proposal Due Date to October 12, 2022. The NGMM program will establish a domestic center for R&amp;D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation.
GrantorContactText: BAA Coordinator&lt;br/&gt;HR001122S0050@darpa.mil
CloseDateExplanation: See Full Announcement for details.