OpportunityTitle: FY2024 CHIPS R&amp;D National Advanced Packaging Manufacturing Program (NAPMP) Materials &amp; Substrates
AdditionalInformationOnEligibility: Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tribal governments. Eligible applicants may only submit one full application under this NOFO. Entities may not be included as subrecipients on more than two applications.
Description: The CHIPS Research and Development Program (CHIPS R&amp;D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R&amp;D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems.
GrantorContactEmailDescription: Agency Contact
GrantorContactText: Misty L Roosa &lt;br/&gt;Management Analyst