OpportunityTitle: Communications, Circuits, and Sensing-Systems
Description: The Communications, Circuits, and Sensing-Systems (CCSS) program is intended to spur visionary systems-oriented activities in collaborative, multidisciplinary, and integrative research. CCSS supports systems research in hardware, signal processing techniques, and architectures to enable the next generation of cyber systems (CPS) that leverage computation, communication, and algorithms integrated with physical domains. CCSS offers new challenges at all levels of systems integration to address future societal needs. CCSS supports innovative research and integrated educational activities in micro- and nano-systems, communications systems, and cyber systems. The goal is to design, develop, and implement new complex and hybrid systems at all scales, including nano, micro, and macro, that lead to innovative engineering principles and solutions for a variety of application domains including, but not limited to, healthcare, medicine, environmental monitoring, communications, disaster mitigation, homeland security, transportation, manufacturing, energy, and smart buildings. CCSS also supports integration technologies at both intra-and inter-chip levels, new and advanced radio frequency (RF), millimeter wave and optical wireless and hybrid communications systems architectures, and sensing and imaging at terahertz (THz) frequencies. Proposals for the CCSS program may involve collaborative research to capture the breadth of expertise needed for such multidisciplinary integrative activities. ECCS will consider supporting a limited number of small team proposals of three or more Investigators from different disciplines and/or universities.Areas of interest include:Zygmunt HaasCyber-Physical Systems (CPS) Embedded Systems Wireless Communications Algorithms and Networking Integrated Sensing, Communication, and Computational Systems Signal Processing and Coding Cyber Security Cognitive RadioRajinder KhoslaSensors, Actuators, and Electronic Interfaces Chemical, Biological, and Physical Diagnostic Systems Implantable and Wearable Systems Environmental Sensing and Monitoring MEMS/NEMS Devices System Level Fabrication, Packaging, and AssemblyAndreas WeisshaarRF-Wireless, Optical, and Hybrid Communications Systems Broadband and Low Power Communications RF/Microwave and Millimeter-Wave Components and Circuits Inter- and Intra-Chip Communications and Networking Submillimeter-Wave/Terahertz (THz) Imaging and Sensing Mixed Signal Circuits and Systems Enabling Technologies for Intelligent Communications Systems Interconnects and Packaging Technologies
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GrantorContactText: NSF grants.gov support &lt;br/&gt;grantsgovsupport@nsf.gov &lt;br/&gt;
CloseDateExplanation: Replaced by PD-12-7564