OpportunityTitle: Wafer Scale Infrared Detectors (WIRED)
Description: Amendment No. 01: The purpose of this amendment is to extend the proposal due date from 23 November 2015 to 30 November 2015. The due date is being extended due to issues with DARPA&#8217;s BAA (proposal submission) Website experienced by proposers on 23 November 2015 that prevented proposal submissions from being completed. Those proposers who successfully submitted through DARPA&#8217;s BAA (proposal submission) Website prior to the original due date are not required to resubmit their proposals as a result of this extension. However, those proposers who did successfully submit through DARPA&#8217;s BAA (proposal submission) Website prior to the original due date may, if they choose, resubmit their proposals &#8211; but the resubmitted proposal must very clearly note that it is being submitted in place of the initial submission. See the attached DARPA-BAA-15-57 document, through Amendment No. 01, with changes highlighted in yellow. Original synopsis is below. DARPA is soliciting research proposals to develop novel technologies for infrared sensors. The WIRED program seeks to provide high-performance, low-cost infrared imagers that respond in the short wave infrared (SWIR) and mid wave infrared (MWIR), and that can be fabricated directly on silicon-based readout integrated circuit (ROIC) substrates at the wafer scale. Also of interest are innovative approaches to high temperature long wave infrared (LWIR) detectors that directly measure photocurrent.
GrantorContactEmailDescription: BAA Coordinator
GrantorContactText: Dr. Jay Lewis &lt;br/&gt;Program Manager