OpportunityTitle: Self-HEALing mixed-signal Integrated Circuits (HEALICs)
Description: The purpose of this modification is to extend the due date of the Full proposals to 9 September 2008 and to add an attachment. See the attached conform BAA document. Original notice below.DARPA is soliciting innovative research and development (R&amp;D) proposals in the area of self-healing mixed signal Integrated Circuits (ICs)/Systems-on-a-Chip (SoCs). The goal of the program is the development of techniques to maximize the number of fully operational mixed-signal SoCs on an individual wafer that meet all performance goals in the presence of extreme process variations and environmental conditions. See attached full BAA document. Submit your questions to BAA08-40@darpa.mil
GrantorContactEmailDescription: BAA Coordinator
GrantorContactText: Dr. Sanjay Raman &lt;br/&gt;DARPA Program Manager &lt;br/&gt;Microsystems Technology Office &lt;br/&gt;3701 North Fairfax Drive &lt;br/&gt;Arlington, VA 22203-1714 &lt;br/&gt;Fax: (703) 248-8062 &lt;br/&gt;Phone: (571) 218-4339 &lt;br/&gt;  &lt;br/&gt;
CloseDateExplanation: Dates:  Proposal Abstract Due Date and time &#150;4:00 PM EST July 9, 2008  Proposal Due Date and time &#150; 4:00 PM EST September 9, 2008  Proposer&#146;s Day &#150; June 19, 2008