OpportunityTitle: Magnetic Miniaturized and Monolithically-Integrated Components (M3IC)
Description: The DARPA Microsystems Technology Office is soliciting innovative research proposals to develop integrated magnetic components on semiconductor substrates that will reduce size and enable new functionality for U.S. Department of Defense (DoD) electromagnetic (EM) systems. Proposals will focus on one or more of the following technical areas: 1) integration of magnetic components on semiconductor substrates, 2) modeling the system-level impact of nonlinear, non-reciprocal, time-dependent magnetic phenomena, and 3) optimization of miniaturized microwave magnetic components. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.
GrantorContactEmailDescription: BAA Coordinator
GrantorContactText: Dr. William D. Palmer &lt;br/&gt;DARPA Program Manager