OpportunityTitle: Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals)
Description: Amendment 01: The purpose of this Amendment is to revise the full proposal due date and to make technical revisions as highlighted in yellow in the attached conformed DARPA-BAA-12-50 document. Original Synopsis below. The ICECool Fundamentals thrust is the first step toward achieving the goals of the ICECool program and will develop the fundamental building blocks of intra- and interchip evaporative microfluidic cooling. ICECool Fundamentals will develop and demonstrate the microfabrication techniquesneeded to implement evaporative microfluidics in multiply-microchanneled semiconductor wafers and study, model, and correlate the thermofluidic characteristics of evaporative flows in such microchannel flow loops within individual chips and/or in the microgaps between chips in 3D stacks. See the full DARPA-BAA-12-50 document attached.
GrantorContactEmailDescription: MTO BAA Coordinator
GrantorContactText: Dr. Avram Bar-Cohen &lt;br/&gt;Program Manager