OpportunityTitle: Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D)
AdditionalInformationOnEligibility: All responsible sources capable of satisfying the Government&apos;s needs may submit a proposal that shall be considered by DARPA.  See the Eligibility Information section of the BAA for more information.
Description: The Minitherms3D program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.
GrantorContactText: BAA Coordinator&lt;br/&gt;HR001123S0019@darpa.mil
CloseDateExplanation: See Full Announcement for details.